Precision embossing/bonding
MiNAN has developed a precision embossing/bonding system:
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Maximum press force 20KN
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Maximum piston stroke 150mm
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Working height approx. 150mm (between the heated platens)
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Chromium plated columns and heating platform
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180 x 180mm working area
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Heating plate is isolated with high-temperature uniformity (+/-1 degree C)
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High level parallelism of the upper and lower hot/cooling plate system (</=20um)
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Cooling system
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Serve-motor driven system with high precision motion control (5um)
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Multi-positions and multi-torques based control
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Touch screen
We offer Precision bonding and surface treatment:
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Thermal bonding
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Solvent bonding
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Hydrophobic treatment
Bonding strength: ~2MPa
Bonding tolerance: <5µm
We offer micro hot embossing:
We can offer fabrication of micro hot embossing microfluidic devices by design embossing micro tools, fixtures, drilling and bonding services.